The thermal problem LED is LED manufacturers knottiest problem, but you can use aluminum substrate, because aluminum thermal conductivity coefficient, heat, and effectively will export the internal heat. Aluminum plate is a unique metal-clad with good thermal conductivity, electrical insulation performance and mechanical processing performance. Design-time to negotiate volume PCB will be close to the aluminum base, thus reducing the potting production of thermal resistance.

First, LED the characteristics of aluminum substrate

1. adopts the surface mount technology (SMT);

2. in circuit design for thermal diffusion is extremely effective treatment;

3. reducing product operating temperature, improve product power density and reliability and prolongs the product's life;

4. to reduce product size, reduce hardware and Assembly costs;

5. replace the fragile ceramic substrate, better mechanical durability.

Second, the structure of aluminum substrate LED

Aluminum-clad is a metal circuit board materials, copper foil, thermal insulation and metal substrate composition, its structure is divided into three layers:

Cireuitl.Layer line: correspond to normal PCB CCL, line copper foil thickness loz to 10oz.

DielcctricLayer insulation: the insulating layer is a layer of heat-insulation materials with low thermal resistance.

BaseLayer Base: is the metal substrate, typically aluminum or copper can be selected. Aluminum-clad and traditional epoxy-glass laminates, and so on.

　　Circuit-layer (that is, copper foil etching) usually after the formation of printed circuits to the individual components are connected to each other, in General, circuit-layer requires a lot of current-carrying capacity, so you should use a thicker copper foil, thickness General 35 μ m ~ 280 m; thermal insulation, μ is the aluminum plate where the core technology, it is normally provided by special ceramic-filled special polymer composition, thermal resistance, excellent viscoelasticity, heat aging resistance, able to withstand the mechanical and thermal stress.

　　High performance aluminum plate heat insulating layer is the use of this technology, so that it has very good thermal conductivity and high intensity of electrical insulation performance; metal base is aluminum plate support component, require a high thermal conductivity, typically aluminum sheet, you can also use copper plate (where copper can provide better thermal conductivity), suitable for drilling, cutting, punching and conventional mechanical processing. PCB materials compared with other materials incomparable advantages. Suitable for surface-mount power components SMT public art. Without heatsink, the volume is greatly reduced, thermal effect is extremely good, good insulation properties and mechanical properties.

Third, LED aluminum plate uses:

Purpose: power hybrid IC (HIC).

1. audio device: input, output amplifier, balanced, amplifiers, audio amplifiers, preamplifiers, power amplifiers, etc.
2. the power supply: switching regulator ` DC/AC converters ` SW regulator, etc.
3. the communication electronics devices: high-frequency boost ` filtering appliances ` radio circuit.
4. the Office automation equipment: motor drive, etc.
5. vehicles: electronic regulator ` igniter ` power supply controllers, and so on.
6. computer: the CPU board ` floppy disc drive ` power supply unit, and so on.
7. power modules: convectors ` solid state relay ` bridge, etc.