Aluminum-clad is conforming to the development of electronic products, born in 1969 Japan Sanyo company first invented the aluminum base laminate manufacturing technology, 1974 began to STK series power amplifying hybrid integrated circuits-then in the application areas and consumption are increasing, especially in the developed countries yield rapid growth. If Japan Aluminum clad yield 1991 25 billion yen, 1996 at 60 billion yen, estimated in 2001 will reach 80 billion yen.
　　China-based development of CCL by State-704 factory began in 1988, in 1990 complete universal aluminum matrix CCL's factory-level design, set up the first domestic production of Aluminum clad and put into production. having product performance boost and product series, the 1996 Ministerial design. at present there are State-704 factory general purpose, high thermal conductivity, high frequency and high thermal-series of Aluminum clad. yield 5000 ~ 8000 M 2/year, also in new production lines, completion is expected output of up to 1 000 M 2/year.

　　2 Aluminum clad structure and performance characteristics

　　Aluminum-clad aluminum plate, epoxy resin or epoxy-glass cloth Bond movie, copper foil three via hot pressing, aluminum plate thickness is usually 0.8mm ~ 3.0mm, press uses a different choice. Aluminum-clad has excellent heat dissipation, dimensional stability, electromagnetic shielding and mechanical strength, etc.

　　According to the structure and performance characteristics, Aluminum-clad is divided into three categories: a. Universal aluminum matrix CCL, the insulation consists of epoxy-glass fabric bonded consisting; b. high thermal clad aluminum base, its high thermal conductivity of the insulating layer by epoxy resin or other resin composition; c. high frequency circuit used aluminum matrix CCL, the insulation consists of polyolefin resin or polyimide resin glass fabric adhesive tablets form. Aluminum-clad and conventional FR maximum difference lies in the heat of; to 1.5mm thickness of FR and Aluminum-clad compared to the former thermal resistance R = 20 ~ 22 ° c, the latter thermal resistance R = 1.0 ~ 2.0 ° c, which is much less visible.

　　3 aluminum matrix CCL's technical requirements and test methods

　　So far, there has not been seen International Aluminum clad standard-704 factory in China by responsible for drafting the electronics industry standards the flame retardant aluminum-Copper-Clad Laminates specifications ", the main technical requirements are: size requirements, including Board size and deviation, thickness and deviation, vertical and warp; appearance, including cracks, scratches, Burr and hierarchical, lead oxide film requirements; performance, including the Peel strength, surface resistivity, minimum Breakdown voltage, dielectric constant, combustion and heat resistance and other requirements.

　　In the above specifications set forth in the two Aluminum-clad private detection method. One is the dielectric constant and the dissipation factor measurement method, the value for the variable Q resonant method, the test specimens and tuning capacitor-line access high frequency circuit, measurement of in-line loop Q value of principle-and the second is the thermal resistance measurement methods, to the temperature difference between the different temperature measurement points and import heat ratio to calculate.

　　4. Al-clad applications

　　Aluminum-clad applications: industrial power equipment, such as high-power transistors, solid state relays, pulse motor drive, etc; automobile, such as the Igniter, power controller, AC converters etc; power, such as regulators and switching regulator; tape recorders, and audio devices, such as motor drives, demultiplexer, amplifiers, etc; office automation equipment, such as a printer driver, large monitor substrate, thermal print head; computer, such as the CPU board, power supply equipment; other are semiconductor heat insulation Board, resistor arrays, heat sinks, and solar cell panels, etc.